Advanced PCB Manufacturing
1. Advanced PCBs are commonly used in high-precision electronic devices.With the continuous development of technology, the demand is also getting higher and higher. To this end, the separate advanced PCB production workshop is opened to assist our customers to achieve the best possible time to market and competitive advantage by producing PCBs sustainably at the lowest total price through our fabrication capabilities, delivery punctuality and product quality
2. AllWinPcba is equipped with advanced machines and software from the United States, Japan, Taiwan, EU, and Israel.
3. AllWinPca is committed to supporting much needed advanced fabrication capabilities along the supply chain to build up this potential in a sustainable way. If you want to see standard PCB or quick-turn PCB capabilities, please click this link. Advanced PCB Manufacturing Capability. The information below details some of the key capabilities that AllWinPcba can offer and support today.
Advanced
PCB Capabilities
|
No. |
Category |
Process capability parameter |
| 1 |
Board Type |
Rigid PCB |
| 2 |
Base Material |
See Below “Material” Chart |
| 3 | Number of Layers | 1-50 Layers |
| 4 |
Min Trace Width/Spacing Inner Layer |
2/ 2mil |
| 5 |
Min trace width/spacing Outer Layer |
2.5/ 2.5mil |
| 6 |
Finished Copper Thickness |
0.5-8 oz |
| 7 |
Min Spacing Between Hole to Inner Layer Conductor |
7mil |
| 8 |
Min Spacing Between Hole to Outer Layer Conductor |
6mil |
| 9 |
Min Annular Ring for Component Hole |
5mil |
| 10 |
Min Annular Ring for Via |
3mil |
| 11 |
Min BGA Pitch |
0.2mil |
| 12 |
Min BGA Diameter |
8mil |
| 13 |
Min Hole Size |
0.15mm(CNC)｜0.1mm(Laser Blind) |
| 14 |
Max Aspect Ratio |
14:1 |
| 15 |
Soldermask / Circuit Processing Method |
Film | LDI |
| 16 |
Min Soldermask Bridge Width |
3mil |
| 17 |
Min Thickness for Insulating Layer |
2mil |
| 18 |
Max PCB size |
600*700mm |
| 19 |
HDI & Special Type PCB |
HDI(1-3 steps), Buried capacitance, High frequency mix-pressing (2-14 layers) & resistance, etc. |
| 20 |
Surface Finish |
HASL, HASL lead free, Immersion gold(ENIG), Immersion Tin, OSP, Immersion Silver(Ag), Plating Hard Gold |
Advanced PCB High Performance Materials:
|
Category |
Material for PCB Prototype |
Material for Small and Medium Batch |
|
High-Tg Halogen-free |
shengyi S1170G Halogen-free TG170, TU-862 HF TG170 |
shengyi S1170G Halogen-free TG170, TU-862 HF TG170 |
|
General Tg FR4 |
shengyi S1141, Kingboard KB6160A |
shengyi S1141 |
|
High Halogen-free CTI |
shengyi S1151G( CTI≥600V) |
shengyi S1151G( CTI≥600V) |
|
Medium Tg Halogen-free |
shengyi S1150G Halogen-free TG150 |
shengyi S1150G Halogen-free TG150 |
|
High CTI |
shengyi S1600( CTI≥600V)Kingboard KB6160C |
shengyi S1600( CTI≥600V)Kingboard KB6160C |
|
Special Material (High low temperature) |
shengyi SH260 |
shengyi SH260 |
|
Ceramic Powder Filled High Frequency
|
Rogers4003, Rogers4350, Arlon25N, shengyi S7136 |
Rogers4350, Rogers4003, shengyi S7136 |
|
High Tg FR4 |
S1000-2, S1000-2M, IT180A |
S1000-2, S1000-2M, IT180A |
|
High Frequency PCB PP |
RO4450 0.1mm, shengyi Synamic6 |
RO4450 0.1mm, shengyi s6 |
|
PTFE High Frequency Material |
Rogers, Taconic, Arlon, Taizhou wangling |
Rogers, Taconic, Arlon, Taizhou wangling |
|
High Speed( 1-5G) |
MEG4, Tu-862, Tu-662, Tu-768, S7038, S1165, lsola-FR408HR, lso-FR406, EMC TW-EM370, EM828G IT 170GRANP175FM(Nanya) |
MEG4, Tu-862, Tu-662, Tu-768,S7038, S1165, Isola-FR408HR, Isola-FR406,EMC TW -EM370, EM828GIT170GRA,NP175FM(Nanya) |
PCB Capabilities
PCBA Capabilities
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Printed Circuit Boards
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Contact Us!
Our customer serviceready for your PCB
1.608.698.5398
SVC@allwinpcba.com
