Latest news in the electronics industry丨TSMC: It is not ruled out that the production of advanced chips in Japan will be successfully developed at 2nm
02 Jul 2023 16:47:31 GMT
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According to reports, TSMC held a press conference in Yokohama, Japan on June 30. Zhang Xiaoqiang, deputy general manager of TSMC, said that the possibility of producing advanced chips in Japan in the future cannot be ruled out. At the press conference, TSMC stated that the Japanese factory will be centered on Japanese customers, and it is expected that there will be continuous and strong demand. According to previous news, the factory plans to produce 22/28nm and 12/16nm chips, with a monthly capacity target of 55,000 wafers. TSMC emphasized at the press conference that the 2nm process technology (N2) has been successfully developed and can be mass-produced in 2025 according to the previous target. In addition, Zhang Xiaoqiang also said that the yield rate of 256Mb SRAM has exceeded 50%, and more than 80% of the research and development target has been completed.
2. Dianke equipment realizes full coverage of ion implantation equipment in 28nm process
According to reports, CETC Electronic Equipment Group Co., Ltd. has achieved full coverage of ion implantation equipment in the 28nm process. The report pointed out that ion implanters are the key equipment in chip manufacturing, and 28nm is the mature process with the widest coverage in the current chip application field. Dianke Equipment has continuously made breakthroughs in the core technologies of key modules such as optical path, control, and software, and has formed a full range of ion implanter products such as medium beam current, large beam current, high energy, and third-generation semiconductors, and achieved full coverage of 28nm process.
3. Samsung-LX "Semiconductor Alliance" cooperates to develop next-generation chips
LX Semicon, a fabless company under LX Group, a conglomerate formerly part of LG Group, is considering consigning production of next-generation display driver integrated circuits (DDIs) to Samsung Electronics as a foundry. The collaboration between Samsung and LX is expected to positively impact the Korean semiconductor ecosystem and diversify the supply chain. According to industry sources on July 2, LX Semicon has selected Samsung Electronics as its foundry partner to jointly develop and mass produce next-generation chips.
4. BYD: Sales in the first half of 2023 totaled 1,255,637 units, a year-on-year increase of 94.25%
BYD released its production and sales report for June 2023, with a total sales of 253,046 vehicles in June. Sales in the first half of the year totaled 1,255,637 units, a year-on-year increase of 94.25%. The total sales volume of new energy vehicles in June was 253,046 units, and the cumulative sales volume this year was 1,255,637 units, a year-on-year increase of 95.78%. BYD sold a total of 10,536 new energy passenger vehicles overseas in June; the company's total installed capacity of new energy vehicle power batteries and energy storage batteries in June 2023 will be about 11.816GWh, and the cumulative installed capacity in 2023 will be about 60.250GWh.
5. It is reported that the Apple AirPods Pro charging box will be replaced with a USB-C interface, and the hearing test function is under development
Apple is preparing to launch a USB-C charging case for the AirPods Pro, presumably this fall alongside the iPhone 15 lineup, which will also start from Lightning, Bloomberg's Mark Gurman reports in his latest Power On newsletter. The port switches to a USB-C port. Gurman also revealed that in addition to some of the AirPods features in iOS 17 that Apple announced at WWDC, Apple is also testing a new listening test feature that will play different tones and sounds in the user's ears, Based on the user's response, possible hearing problems can be detected.
6. Nvidia, Broadcom, and AMD have successively added TSMC orders, and the overall order scale will increase by at least 20% compared with 2023
According to reports, Nvidia, Broadcom, and AMD are all investing in TSMC. Coupled with the demand for 3nm chips from Apple’s iPhone and Mac, TSMC’s revenue should rebound significantly in the second half of the year. Due to the growing demand in the AI field, the three companies have not only increased TSMC's 5/7nm orders quarter by quarter since Q2, but also competed for TSMC's CoWoS production capacity. Increased by more than 20%.
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